Solutions Engineer - AE

At Cadence, we hire and develop leaders and innovators who want to make an impact on the world of technology. Solutions Architect Engineer (AE) Advanced Packaging, 3D-IC and SI/PI Location United States (Remote or Hybrid) Job Summary Cadence is seeking a highly motivated and experienced Solutions Application Engineer to support customers developing next-generation advanced packaging solutions, including 2.5D, 3D-IC, chiplet-based architectures, AI/HPC packages, and heterogeneous integration technologies. The successful candidate will work directly with leading semiconductor companies, OSATs, foundries, and system companies to deploy and optimize Cadence Advanced Package 3D-IC associated design flows. This role combines technical expertise, customer engagement, solution development, and collaboration with R&D to drive customer success and product adoption. Responsibilities Provide technical leadership and application support for Cadence 3D-IC design solutions. Assist customers with advanced package architecture, design implementation, and methodology development. Develop and demonstrate complete packaging workflows for: Organic substrates Silicon interposers Wafer Level Packaging 2.5D and 3D-IC integration Chiplet-based package architectures Support customer evaluations, proof-of-concepts, benchmarks, and production deployments. Deliver technical presentations, product demonstrations, workshops, and training sessions. Collaborate with sales teams to identify opportunities